Project Aim 

HiVICS Project Outline
Automotive applications increasingly require high performance, efficient compact ICs operating at up to 100V.

The aim of this project is to design and develop a manufacturing process to address the conflicting demands of electrical isolation, thermal management, low on resistance and high packing density by incorporating novel low thermal resistance silicided SOI substrates and integrating novel device architectures.

To tackle the complex engineering challenges, the project will undertake the essential development of advanced 3D numerical simulations, improvements to existing models and enhancements to available CAD tools.

Probabilistic simulations will be utilised to design for manufacturability and technology assessment vehicles will be fabricated to validate the models and simulations. The new high voltage IC technology on SOI will be offered as a UK silicon foundry service to benefit the UK and EEA automotive IC design SMEs.

 


Design for Manufacturing of High Voltage ICs on SOI for Automotive applications

 

Design For Manufacturing of High Voltage ICs on SOI for Automotive applications

HiVICS is a collaborative R&D programme funded by the UK TSB. The scope of this 3-year programme is the design for manufacturing of High Voltage ICs on SOI for automotive applications.

The challenge of designing a low resistance 100V process, with high packing density will be addressed by incorporating novel low thermal resistance silicided SOI substrates and integrating innovative device architectures.

The project will undertake the development of advanced 3D numerical simulations, improvements to existing models and enhancements to CAD tools. The new high voltage IC technology on SOI will be then offered as a silicon foundry service.